Case Studies
Replacing foam layer pads for electronic manufacturer
The Challenge: 

An electronic engineering manufacturer approached us with a specific request to see if we could replace the foam layer pads in their component packaging. Foam layer pads are not environmentally friendly, hard to recycle and difficult to source. The customer also needed our packaging designs within 48 hours as they had parts to ship and didn’t want to order more foam layer pads. We love a challenge!

The Solution: 

After checking the specification, we provided samples and ran a small trial all within a couple of days. This was for a smaller, more compact fitment to replace the foam layer pads. This was approved and we supplied the fitment.

The Result: 

The customer was over the moon! They really appreciated our ability to react quickly to both a demanding request and timeline and have now replaced their foam layer pads with our cardboard alternative.

“Sandland Packaging were brilliant – they assessed what we wanted, then organised the new design fully tested so we knew it would work. Sandland Packaging are essential to helping us become more environmentally friendly.” Director, Electronic Engineering Manufacturer